Q&A with Ann Kelleher, SVP & GM of Technology Development at Intel on the company’s new logic roadmap, lithography, packaging, and process technology (Semiconductor Engineering)



Q&A with Ann Kelleher, SVP & GM of Technology Development at Intel on the company’s new logic roadmap, lithography, packaging, and process technology  —  Five process nodes in four years, high-NA EUV, 3D-ICs, chiplets, hybrid bonding, and more.  —  Ann Kelleher, senior vice president …



Source link

We will be happy to hear your thoughts

Leave a reply

Dealspapa.com
Logo
Enable registration in settings - general
Compare items
  • Total (0)
Compare
0
Shopping cart